MEET US AT OUR BOOTH LU-8539 AT PACK EXPO CHICAGO

We are excited to announce that TorQ Packaging Srl will be participating in PACK EXPO International, the premier event where the future of the packaging and processing industry comes to life.

As the industry evolves, staying ahead of the curve is essential. PACK EXPO International is the perfect platform to explore the latest innovations, with over 2,500 exhibitors showcasing groundbreaking technologies. This is your opportunity to discover solutions that can propel your business forward, overcome current challenges, and keep you competitive in a rapidly changing market.

📅 Event Details:

• Date: 3 - 6 November 2024
• Location: McCormik Place Chicago, Illinois
• Website: PACK EXPO 2024 | Packaging Trade Show in Chicago

Don't miss this opportunity to connect with us, explore the latest advancements, and discuss how TorQ Packaging can help drive your business forward. We're eager to collaborate with you and share our insights on how to tackle the industry's current and future challenges.